Publications

This is our catalog of recent publications authored by IBM researchers, in collaboration with the global research community. We’re currently adding our back catalog of more than 110,000 publications. It’s an ever-growing body of work that shows why IBM is one of the most important contributors to modern computing.

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5 results for Griselda Bonilla

Electrical Characterization and Modeling of 2-µm and 1.5-µm Line-and-Space High-Density Signal Wiring in Organic Interposer
- - Atom Watanabe
  - Hiroyuki Mori
  - et al.
- 2023
- ECTC 2023
Heterogeneous Integration on Organic Interposer Substrate with fine-pitch RDL and 40 micron pitch Micro-bumps
- - Katsuyuki Sakuma
  - Griselda Bonilla
  - et al.
- 2023
- ECTC 2023
On the Path to AI hardware via Chiplet Integration Enabled by High Density Organic Substrates
- - Griselda Bonilla
  - Brian Quinlan
  - et al.
- 2023
- ECTC 2023
Artificial Intelligence (AI) based methodology to minimize asymmetric bare substrate warpage
- - Sathya Raghavan
  - Hiroyuki Mori
  - et al.
- 2023
- ECTC 2023
Innovative Chiplet Integration Technologies for HPC and AI Hardware Systems
- - Griselda Bonilla
- 2023
- iTHERM 2023