Comparison of sintering methodologies for 3D printed high-density interconnects (2.3 µm L/S) on organic substrates for high-performance computing applications
- Shrivani Pandiya
- Serge Ecoffey
- et al.
- 2023
- ECTC 2023
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5 results for Isabel de Sousa
Development of a Plasma Etching Process of Copper for the Microfabrication of High-Density Interconnects in Advanced Packaging
- Juliano Borges
- Maxime Darnon
- et al.
- 2023
- ECTC 2023
1.65 µm L/S high density interconnect on organic substrate by advanced semi-additive process for HPC applications
- Hussein Hamieh
- Juliano Borges
- et al.
- 2023
- ECTC 2023
Direct Bonded Heterogeneous Integration (DBHi): Surface Bridge Approach for Die Tiling
- Claudia Cristina Barrera Pulido
- Divya Taneja
- et al.
- 2023
- ECTC 2023
Reliable Direct Bonded Heterogeneous Integration ( DBHI) for AI Hardware
- Divya Taneja
- Katherine Pilger
- et al.
- 2024
- DPC 2024