Microreplicated conditioners for Cu barrier chemical-mechanical planarization (CMP)
- Wei-Tsu Tseng
- Sana Rafie
- et al.
- 2015
- ECS J. Solid State Sci. Technol.
Publications
5 results for Vamsi Devarapalli
Post cu cmp cleaning of polyurethane pad debris
- Wei-Tsu Tseng
- Elliott Rill
- et al.
- 2013
- ECS J. Solid State Sci. Technol.
Post copper CMP hybrid clean process for advanced BEOL technology
- Wei-Tsu Tseng
- Vamsi Devarapalli
- et al.
- 2013
- IEEE Trans Semicond Manuf
Hybrid clean approach for post-copper CMP defect reduction
- Wei-Tsu Tseng
- Vamsi Devarapalli
- et al.
- 2013
- ASMC 2013
Post Cu CMP cleaning process evaluation for 32nm and 22nm technology nodes
- Wei-Tsu Tseng
- Donald Canaperi
- et al.
- 2012
- ASMC 2012