Reduced electromigration of Cu wires by surface coating
- C.-K. Hu
- L. Gignac
- et al.
- 2002
- Applied Physics Letters
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144 results for Lynne Gignac
In situ study of void growth kinetics in electroplated Cu lines
- E. Liniger
- L. Gignac
- et al.
- 2002
- Journal of Applied Physics
Electromigration in on-chip single/dual damascene Cu interconnections
- C.-K. Hu
- L. Gignac
- et al.
- 2002
- JES
High-quality aluminum oxide gate dielectrics by ultra-high-vacuum reactive atomic-beam deposition
- S. Guha
- E. Cartier
- et al.
- 2001
- Journal of Applied Physics
Electromigration in AlCu lines: Comparison of Dual Damascene and metal reactive ion etching
- R. Filippi
- M. Gribelyuk
- et al.
- 2001
- Thin Solid Films
Mechanisms for very long electromigration lifetime in dual-damascene Cu interconnections
- C.-K. Hu
- L. Gignac
- et al.
- 2001
- Applied Physics Letters
High coercivity of ultra-high-density ordered Co nanorod arrays
- T. Shibauchi
- L. Krusin-Elbaum
- et al.
- 2001
- Journal of Magnetism and Magnetic Materials
Dynamics of one-dimensional domain walls interacting with disorder potential
- L. Krusin-Elbaum
- T. Shibauchi
- et al.
- 2001
- Journal of Magnetism and Magnetic Materials
The microstructure of submicrometer wide planar-reactive ion etched versus trench-damascene AlCu lines
- K.P. Rodbell
- L. Gignac
- et al.
- 2000
- Journal of Applied Physics
Mechanisms for microstructure evolution in electroplated copper thin films near room temperature
- J.M.E. Harper
- C. Cabral Jr.
- et al.
- 1999
- Journal of Applied Physics