Fluxless bonding for fine-pitch and low-volume solder 3-D interconnections
- Katsuyuki Sakuma
- Kazushige Toriyama
- et al.
- 2011
- ECTC 2011
Publications
23 results for Kazushige Toriyama
Ultrafine-pitch C2 flip chip interconnections with solder-capped Cu pillar bumps
- Yasumitsu Orii
- Kazushige Toriyama
- et al.
- 2009
- ECTC 2009
Injection molded solder - a new fine pitch substrate bumping method
- Jae-Woong Nah
- Peter A. Gruber
- et al.
- 2009
- ECTC 2009