The projection of the incidence of dielectric cracking during chip joining with lead free solder bumps
- Thomas M. Shaw
- Xiao Hu Liu
- et al.
- 2016
- IRPS 2016
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The strength of BEOL structures fabricated using low K materials and its impact on CPI failures
- Thomas M. Shaw
- Xiao Hu Liu
- et al.
- 2015
- IIRW 2015