A Multiscale Workflow for Thermal Analysis of 3DI Chip Stacks
- Max Bloomfield
- Amogh Wasti
- et al.
- 2025
- ITherm 2025
Publications
2 results for Max Bloomfield
Experimental Cross-Plane Thermal Transport Characterization of BEOL Materials and Sensitivity to In-Plane Thermal Transport
- Amogh Wasti
- Zongmin Yang
- et al.
- 2025
- ITherm 2025