Fully subtractive Ru Topvia interconnects with minimum 9 nm-space airgap for RC performance and reliability enhancement as post-Cu interconnects
- Koichi Motoyama
- Jaemyung Choi
- et al.
- 2024
- IEDM 2024
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High Volume Manufacturing Innovations for Metal-Oxide Resist Patterning
- Nicholas Latham
- Jennifer Church
- et al.
- 2025
- SPIE Advanced Lithography + Patterning 2025