Publications

2 results for Daisuke Oshima

Graphite sheet embedded in an organic flip-chip package for heat spreading
- - Keiji Matsumoto
  - Daisuke Oshima
  - et al.
- 2025
- ECTC 2025
Neuromorphic devices and their packaging technologies for next generation computing
- - Daisuke Oshima
- 2024
- Workshop on LSI and Systems 2024