Modeling Effect of Grain Orientation on Degradation in Tin-Based Solder - Part II: Electromigration Experiments
- Jiamin Ni
- Matt Ring
- et al.
- 2019
- IEEE Transactions on CPMT
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3 results for Antoinette M. Maniatty
Modeling effect of grain orientation on degradation in tin-based solder: I. current-driven diffusion
- Yuanxiang Zhang
- Jiamin Ni
- et al.
- 2019
- IEEE Transactions on CPMT
Thermal and electromigration-induced strains in copper conductor lines: X-ray microbeam measurements and analysis
- G. Wang
- H. Zhang
- et al.
- 2006
- MRS Spring Meeting 2006