Scaling challenges of packaging in the Era of Big Data
- Yasumitsu Orii
- Akihiro Horibe
- et al.
- 2013
- VLSI Technology 2013
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24 results for Akihiro Horibe
Vacuum underfill technology for advanced packaging (IMPACT 2011)
- M. Hoshiyama
- M. Hasegawa
- et al.
- 2011
- IMPACT 2011
High channel count connector for optical interconnect
- Yoichi Taira
- Fumiaki Yamada
- et al.
- 2008
- OF&T 2008
Full intermetallic joints for chip stacking by using thermal gradient bonding
- T.L. Yang
- Toyohiro Aoki
- et al.
- 2016
- Acta Materialia