Publications

5 results for Kamalesh K. Srivastava

Chip to carrier C4 technology challenges with Pb-free solders
- - Eric D. Perfecto
  - Brian Sundlof
  - et al.
- 2008
- CICC 2008
C4NP technology: Present and future
- - Eric Perfecto
  - Da-Yuan Shih
  - et al.
- 2008
- GBC 2008
Effects of Parylene Coating on the Thermal Fatigue Life of Solder Joints in Ceramic Packages
- - Ho-Ming Tong
  - Lawrence S. Mok
  - et al.
- 1993
- IEEE Transactions on Components, Hybrids, and Manufacturing Technology
Integrity of ceramic packages upon liquid nitrogen cycling
- - Ho-Ming Tong
  - H.L. Yeh
  - et al.
- 1989
- ECTC 1989
Ceramic Packages for Liquid-Nitrogen Operation
- - Ho-Ming Tong
  - Helen L. Yeh
  - et al.
- 1989
- IEEE T-ED