Vertical fiber coupling for high-density optical interconnection

Abstract

A GaAs/AIGaAs fiber-optic interconnect structure for high-density applications is discussed. The vertical approach, which employs reactive-ion-etched cavities to couple fibers to the semiconductor substrate, permits interconnect arrays with densities up to 1600 sites/cm2. Factors affecting the applicability of the fiber coupler and the achievable packing density are considered. © 1989 SPIE.