L.K. Wang, A. Acovic, et al.
MRS Spring Meeting 1993
The use of nonflammable and nontoxic gases CF4, CF2C12, and SF6 for the reflow and bonding of Pb/Sn solder has been demonstrated. It has been found that a concentration of these gases on the order of l%~5% in a 760 Torr atmosphere of nitrogen or argon is sufficient for soldering. © 1986, American Vacuum Society. All rights reserved.
L.K. Wang, A. Acovic, et al.
MRS Spring Meeting 1993
Zelek S. Herman, Robert F. Kirchner, et al.
Inorganic Chemistry
Mitsuru Ueda, Hideharu Mori, et al.
Journal of Polymer Science Part A: Polymer Chemistry
Ellen J. Yoffa, David Adler
Physical Review B