Thermal dry process soldering

The use of nonflammable and nontoxic gases CF4, CF2C12, and SF6 for the reflow and bonding of Pb/Sn solder has been demonstrated. It has been found that a concentration of these gases on the order of l%~5% in a 760 Torr atmosphere of nitrogen or argon is sufficient for soldering. © 1986, American Vacuum Society. All rights reserved.