ECS Meeting 2009
Conference paper

The effect of material and process interactions on BEOL integration

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In agreement with the ITRS roadmap, there have been several publications supporting the reduction in critical dimensions and the introduction of new materials to semiconductor processing (1, 2, 3). This paper highlights the observations and solutions to some of the critical material and process interactions encountered during the integration of the back end of line interconnect. © The Electrochemical Society.