Tantalum and chromium adhesion to polyimide. Part 2. peel and locus of failure analyses

Abstract

Ta and Cr adhesion to 3,3’-4,4’-biphenyl tetracarboxylic acid dianhydride-p-phenyl- enediamine derived (BPDA-PDA) polyimide (PI) surfaces has been studied before treatment, and after CF4 reactive ion etching (RIE), and Ar sputtering. The initial peel adhesion results for both metals on the BPDA-PDA surfaces are comparable and show increased peel adhesion as a function of the surface treatment in the following order: virgin (no treatment) < Ar sputter < CF4 RIE ~ CF4 RIE followed by Ar sputter. The surface roughness effect on metal/PI adhesion has also been investigated. The data suggest that the surface roughness does not primarily affect peel adhesion. In this case, it is the removal of the weak boundary layer and the cracking of the residual PI on the metal peel interface surface during the peeling process which cause the increase in the peel strength. It is also proposed that the changes observed in the peel strength as a function of the surface treatment arc due to differences in the fracture toughness of the modified PI layers rather than differences in the surface roughness. © VSP 1993.