Haifeng Qian, Sani R. Nassif, et al.
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
In this brief, a temperature-and variation-aware electromigration analysis (T-VEMA) tool for power grid wires is described. First, T-VEMA performs a two-stage interconnect thermal analysis on a full chip. Next, the tool extracts the effective jL product values and performs an electromigration (EM) lifetime calculation on ideally manufactured mortal wires on the basis of thermal effects. Finally, T-VEMA analyzes process variation effects on EM reliability at global and local levels and reports variation tolerances of EM-sensitive power grid wires.
Haifeng Qian, Sani R. Nassif, et al.
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Sani R. Nassif, Zhuo Li
ISQED 2005
Emrah Acar, Lawrence T. Pileggi, et al.
DATE 2002
Iris Hui Ru Jiang, Gi Joon Nam, et al.
ICCAD 2014