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IEEE Transactions on VLSI Systems
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T-VEMA: A Temperature-and Variation-Aware Electromigration Power Grid Analysis Tool

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Abstract

In this brief, a temperature-and variation-aware electromigration analysis (T-VEMA) tool for power grid wires is described. First, T-VEMA performs a two-stage interconnect thermal analysis on a full chip. Next, the tool extracts the effective jL product values and performs an electromigration (EM) lifetime calculation on ideally manufactured mortal wires on the basis of thermal effects. Finally, T-VEMA analyzes process variation effects on EM reliability at global and local levels and reports variation tolerances of EM-sensitive power grid wires.

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IEEE Transactions on VLSI Systems

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