Conference paperCoupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systemsBiancun Xie, Madhavan Swaminathan, et al.EMC 2011
PaperSuperconductivity of lanthanum intermetallic compounds with the Cu3Au structureR.J. Gambino, N.R. Stemple, et al.Journal of Physics and Chemistry of Solids
PaperHierarchical hydrodynamic flow confinement: Efficient use and retrieval of chemicals for microscale chemistry on surfacesJulien Autebert, Aditya Kashyap, et al.Langmuir
PaperSmall Signal Capacitance in Ferroelectric HZO: Mechanisms and Physical InsightsRevanth Kodoru, Atanu Saha, et al.arXiv
