American Chemical Society, Polymer Preprints, Division of Polymer Chemistry

Paper

01 Mar 1996

Structure-property relationships of nano-foam polyimide films with low dielectric constant and high thermal stability

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Recent advances in high temperature polymers for microelectronic applications

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International SAMPE Electronics Conference 1989

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Templating nanopores into poly(methylsilsesquioxane): new low-dielectric coatings suitable for microelectronic applications

J. Remenar, C.J. Hawker, et al.

MRS Spring Meeting 1998

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Dual living free radical and ring opening polymerizations from a double-headed initiator

C.J. Hawker, J.L. Hedrick, et al.

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Toughened, inorganic-organic hybrid materials for microelectronic application

J.L. Hedrick, S.A. Srinivasan, et al.

MRS Fall Meeting 1996

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