About cookies on this site Our websites require some cookies to function properly (required). In addition, other cookies may be used with your consent to analyze site usage, improve the user experience and for advertising. For more information, please review your options. By visiting our website, you agree to our processing of information as described in IBM’sprivacy statement. To provide a smooth navigation, your cookie preferences will be shared across the IBM web domains listed here.
Paper
Stress-enhanced diffusion in thin films
Abstract
Stress enhancement of grain boundary diffusion of Be in thin Al films was investigated using a new experimental technique. Plane biaxial tensile stresses were found to promote lateral penetration of Be along the grain boundaries of A1 films. © 1970, Taylor & Francis Group, LLC. All rights reserved.