Publication
Philosophical Magazine
Paper

Stress-enhanced diffusion in thin films

View publication

Abstract

Stress enhancement of grain boundary diffusion of Be in thin Al films was investigated using a new experimental technique. Plane biaxial tensile stresses were found to promote lateral penetration of Be along the grain boundaries of A1 films. © 1970, Taylor & Francis Group, LLC. All rights reserved.

Date

20 Aug 2006

Publication

Philosophical Magazine

Authors

Share