S.-L. Zhang, F.M. d'Heurle
Thin Solid Films
Films of WSi2 initially deposited in an amorphous form have been known to display an unexpected resistivity maximum when annealed at a temperature corresponding to the transition from the low-temperature hexagonal structure to the high-temperature tetragonal structure. It is shown that the resistivity maximum is due to an extremely high (5×106/cm) density of stacking faults. Thus, at least one of the scattering defects which contribute to the relatively high resistivity of WSi2 films has been identified.
S.-L. Zhang, F.M. d'Heurle
Thin Solid Films
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Silicon Materials Science and Technology 1990
S.K.H. Fung, N. Zamdmer, et al.
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Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures