L.K. Wang, A. Acovic, et al.
MRS Spring Meeting 1993
The initial stage of the thermal oxidation of various crystallographic orientations of silicon ((100), (110), and (111) orientations) reveals a complex rate behavior. This behavior is not understood within the conventional linear-parabolic model. A recently revised model which explicitly contains the areal density of Si atoms and mechanical stress effects is shown to provide both a qualitative (for all orientations studied) and somewhat quantitative (for (110) and (111) orientations) explanation of the complex substrate orientation effects. © 1986, The Electrochemical Society, Inc. All rights reserved.
L.K. Wang, A. Acovic, et al.
MRS Spring Meeting 1993
O.F. Schirmer, W. Berlinger, et al.
Solid State Communications
Mark W. Dowley
Solid State Communications
Julien Autebert, Aditya Kashyap, et al.
Langmuir