Self-assembled subnanolayers as interfacial adhesion enhancers and diffusion barriers for integrated circuits

Abstract

Self-assembled subnanolayers as interfacial adhesion enhancers and diffusion barriers for integrated circuits were investigated. Self-assembled monolayers (SAMs) ∼0.7 nm-thick enhanced adhesion and inhibited Cu diffusion at Cu/SiO2 structures. Cu/SAM/SiO2/Si(001) structures showed three times higher interface debond energy compared to Cu/SiO2 interfaces.