Publication
Applied Physics Letters
Paper

Reversible hillock growth in thin films

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Abstract

Thin films of lead and aluminum on substrates of lower thermal expansion coefficient were examined using a hot stage in a scanning electron microscope. Hillocks were seen to grow as the temperature was increased and then to shrink as the temperature slowly fell. This effect is thought to be caused by a change from compressive into tensile stress in the film. © 1969 The American Institute of Physics.

Date

21 Oct 2003

Publication

Applied Physics Letters

Authors

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