UV-hardening/photostabilization process is used for preventing thermal flow of resist images at high temperatures. Because of high temperature stability and highly crosslinked nature of resist surfaces, UV-hardening is used for resist enhancement for reactive ion etchings of metals, high temperature sputtering, lift-off and others. We like to present here multilayer resist applications using highly crosslinked resist surfaces. Because of large deep UV absorption coefficients, application of UV-hardening to thick films is limited. For thick resist films, resist stabilization by pulsed electron beams operating in soft vacuum  is far more efficient because of deeper penetration of electron beams of 25 KeV energy. The present technique has an advantage over a conventional CW electron source with a larger diameter, cold cathode of an ordinary metal operating in a soft vacuum with high efficiency. Exposures of resist images to organometallic compounds either in vapor phase or in solutions provide them specific RIE resistances and thermal flow resistance. © 1987.