Physical design challenges for performance
D.P. LaPotin, Uttam Ghoshal, et al.
ISPD 1997
Two different refrigeration technologies developed for server applications are described. While mechanical vapor-compression systems solved the refrigeration problems in high end servers and few processor systems, advanced thermoelectric coolers were stated to offer promising solutions for sub-ambient operation of low-end servers, parallel processor systems and extending the temperature differentials in vapor-compression systems. Thin film thermoelectric coolers were described to be ideal for sub-ambient operation of complementary metal oxide semiconductor (CMOS) circuits.
D.P. LaPotin, Uttam Ghoshal, et al.
ISPD 1997
Joel Silberman, Naoaki Aoki, et al.
IEEE Journal of Solid-State Circuits
Uttam Ghoshal, S. Ghoshal, et al.
Applied Physics Letters
Sandip Kundu, Uttam Ghoshal
EDTC 1997