PaperA novel approach to photonic packaging leveraging existing high-throughput microelectronic facilitiesTymon Barwicz, Yoichi Taira, et al.IEEE JSTQE
Conference paperBuilding a packaging hierarchy for optical interconnects using polymer waveguides: Exploring the optionsStephen L. Buchwalter, Russell Budd, et al.GBC 2006
Conference paperSolder-reflowable single-mode fiber array photonics assembly in high-throughput manufacturing facilitiesAlexander Janta-Polczynski, Elaine Cyr, et al.SPIE OPTO 2019
Conference paperA polymer waveguide material optimized for on-board optical links and Si photonic interfacesShotaro Takenobu, Kenta Kobayashi, et al.OFC 2017
