About cookies on this site Our websites require some cookies to function properly (required). In addition, other cookies may be used with your consent to analyze site usage, improve the user experience and for advertising. For more information, please review your options. By visiting our website, you agree to our processing of information as described in IBM’sprivacy statement. To provide a smooth navigation, your cookie preferences will be shared across the IBM web domains listed here.
Publication
IEEE T-ED
Paper
Recombination Measurement of n-Type Heavily Doped Layer in High/Low Silicon Junctions
Abstract
The hole lifetime within a heavily doped n<sup>+</sup> region has been determined using a measurement technique which evaluates the effective recombination velocity of n-n<sup>+</sup> interfaces. Measurements of n<sup>+</sup> layers of different types, like substrates, implanted buried layers, and diffused layers, suggest that the minority-carrier lifetime of such regions can be strongly degraded by the device fabrication processes. Results are consistent with the SRH lifetime value two orders of magnitude lower than values for bulk material reported in literature. © 1991 IEEE