About cookies on this site Our websites require some cookies to function properly (required). In addition, other cookies may be used with your consent to analyze site usage, improve the user experience and for advertising. For more information, please review your options. By visiting our website, you agree to our processing of information as described in IBM’sprivacy statement. To provide a smooth navigation, your cookie preferences will be shared across the IBM web domains listed here.
Publication
Journal of Applied Physics
Paper
Reaction between Cu and PtSi with Cr, Ti, W, and C barrier layers
Abstract
The Cu/PtSi metallurgy is studied for reaction and thermal stability using several barrier layers, Cr, Ti, W, and amorphous C. Using preformed PtSi and Cr, Ti, and W barrier layers, Cu is found to react with PtSi around 350 °C. The results are compared with those using similar barriers for the Al/PtSi structure, where an improvement in thermal stability by 50-150 °C is observed. The low thermal stability of the Cu/PtSi structures is attributed to the high affinity of Cu to Si, with the Cu silicide formation starting around 200 °C for a Cu/Si structure. Using an amorphous carbon barrier for the Cu/PtSi structure, a small amount of Cu silicide is observed at 400 °C, but not at 600 °C. Migration of Cu into the structure, however, makes uncertain the effectiveness of the carbon barrier. The results are compared with those of Al/C/PtSi, Al/C/Pd/Si, and C/Cu/SiO2 to understand the mechanism involved.