About cookies on this site Our websites require some cookies to function properly (required). In addition, other cookies may be used with your consent to analyze site usage, improve the user experience and for advertising. For more information, please review your options. By visiting our website, you agree to our processing of information as described in IBM’sprivacy statement. To provide a smooth navigation, your cookie preferences will be shared across the IBM web domains listed here.
Conference paper
Principles for physical-based gridding of package structures
Abstract
We describe a number of rules for gridding packaging structures for subsequent electromagnetic analysis. The rules are based upon conductor proximity and other physical effects. Difficulties in developing the associated gridding algorithms are discussed and examples are presented. © 2006 IEEE.