Abstract
Recently two independent applications have emerged for highly radiation-sensitive polymers: as resists for production of microelectronic circuitry and as materials to record the tracks of energetic nuclear particles. The relief images used for masking in resist materials are generated by radiation-induced differential dissolution rates whereas the techniques used in recording nuclear particle tracks employ differential etching processes, that is, development by a chemical etchant that actually degrades the polymer. We have found that the sensitivity of materials to these very different processes is related to their γ-ray scission efficiency (G of scission). This correlation provides a predictive capability. © 1982, The Electrochemical Society, Inc. All rights reserved.