IEEE Transactions on Advanced Packaging
Conference paper

Physically consistent transmission line models for high-speed interconnects in lossy dielectrics

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The development of a physically consistent multiconductor transmission line model for high-speed interconnects in lossy, dispersive dielectrics is presented. Based on this model, a methodology is presented which constructs SPICE-compatible equivalent circuits that take into account dielectric loss and dispersion. Simulations using wideband measurement data of alumina demonstrate the effect of the Debye based permittivity model.