M. Wittmer, D.A. Smith, et al.
Applied Physics Letters
A passive, self-aligned packaging technique for semiconductor laser arrays has been realized. Alignment trenches on the laser chip are used for self-alignment during flip-chip mounting on a silicon motherboard. The use of the etched Si sidewalls for alignment results in a self-positioning effect, reducing the necessary device placing precision, and allowing for large tolerances in the motherboard processing, resulting in low packaging costs. A module with four lasers and integrated monitor diodes has been pigtailed with multimode fibers. Optical mounting excess and differential losses between the channels are <0.5 dB. © 1995 IEEE
M. Wittmer, D.A. Smith, et al.
Applied Physics Letters
H. Kaufmann, R. Hirter, et al.
Electronics Letters
R. Loepfe, A. Schaelin, et al.
Applied Physics Letters
P. Buchmann, H. Kaufmann, et al.
SPIE International Technical Symposium/Europe 1985