About cookies on this site Our websites require some cookies to function properly (required). In addition, other cookies may be used with your consent to analyze site usage, improve the user experience and for advertising. For more information, please review your options. By visiting our website, you agree to our processing of information as described in IBM’sprivacy statement. To provide a smooth navigation, your cookie preferences will be shared across the IBM web domains listed here.
Publication
IEEE Photonics Technology Letters
Paper
Passive Self-Aligned Low-Cost Packaging of Semiconductor Laser Arrays on Si Motherboard
Abstract
A passive, self-aligned packaging technique for semiconductor laser arrays has been realized. Alignment trenches on the laser chip are used for self-alignment during flip-chip mounting on a silicon motherboard. The use of the etched Si sidewalls for alignment results in a self-positioning effect, reducing the necessary device placing precision, and allowing for large tolerances in the motherboard processing, resulting in low packaging costs. A module with four lasers and integrated monitor diodes has been pigtailed with multimode fibers. Optical mounting excess and differential losses between the channels are <0.5 dB. © 1995 IEEE