Panel movement effects on solution flow in through‐holes of printed circuit panels

Abstract

A hydrodynamic model is developed relating the movement of printed circuit panels to solution flow in through‐holes. Qualitative and quantitative model verification is experimentally established. Effects of external gas bubbling on hole solution transport are elucidated. Based on the hydrodynamic model, panel motion criteria for contamination‐free and fast chemical processing are introduced. Limits of mechanical panel movement as a method for processing holes of different geometry with typical wet chemical process baths are addressed. Copyright © 1987 American Institute of Chemical Engineers