About cookies on this site Our websites require some cookies to function properly (required). In addition, other cookies may be used with your consent to analyze site usage, improve the user experience and for advertising. For more information, please review your options. By visiting our website, you agree to our processing of information as described in IBM’sprivacy statement. To provide a smooth navigation, your cookie preferences will be shared across the IBM web domains listed here.
Publication
Applied Physics Letters
Paper
Oxygen defects and Fermi level location in metal-hafnium oxide-silicon structures
Abstract
We describe an in situ method for measuring the band bending of Si substrates in complex metal-oxide-semiconductor systems using femtosecond pump-probe photoelectron spectroscopy. Following deposition of metal layers (Pt, Re, or Re oxide) on the high- k dielectric HfO2, measurement of the band bending in the underlying Si provides a direct determination of the location of the Fermi level within the Si band gap at the Si-dielectric interface. Changes in the Fermi level with post-deposition anneals and oxygen exposure were correlated with valence and core photoelectron spectroscopy as well as capacitance-voltage measurements. These studies illuminate the roles that gate metal work function, modified by metal induced gap states and defects within the oxide, such as oxygen vacancies, play in defining the location of the Fermi level in metal-oxide-semiconductor structures. © 2005 American Institute of Physics.