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Conference paperNEW RELIABLE STRUCTURE FOR HIGH TEMPERATURE MEASUREMENT OF SILICON WAFERS USING A SPECIALLY ATTACHED THERMOCOUPLE.S. Cohen, T.O. Sedgwick, et al.MRS Proceedings 1983
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Conference paperHigh-performance sub-0.08 μm CMOS with dual gate oxide and 9.7 ps inverter delayM. Hargrove, S.W. Crowder, et al.IEDM 1998
