About cookies on this site Our websites require some cookies to function properly (required). In addition, other cookies may be used with your consent to analyze site usage, improve the user experience and for advertising. For more information, please review your options. By visiting our website, you agree to our processing of information as described in IBM’sprivacy statement. To provide a smooth navigation, your cookie preferences will be shared across the IBM web domains listed here.
Publication
JES
Paper
Optimization of Electrodeposit Uniformity by the Use of Auxiliary Electrodes
Abstract
A numerical model is used to examine how the uniformity of current distribution at a flat electrode can be improved using a coplanar auxiliary electrode. A boundary-element code, based on potential theory and Tafel kinetics, determines the current that must be passed at a surrounding auxiliary electrode to minimize nonuniformity on a round cathode. Nonuniformity is quantified by the root-mean-square deviation from the mean current density over the cathode surface. The importance of geometric factors such as the size and position of the auxiliary electrode is examined. Applications to plating in the electronics industry and to rotating-disk electrodes are discussed. © 1990, The Electrochemical Society, Inc. All rights reserved.