Alina Deutsch, Christopher W. Surovic, et al.
IEEE Transactions on Components Packaging and Manufacturing Technology Part B
This paper reviews the status of present day on-chip wiring design methodologies and understanding. A brief explanation it, given of the fundamental transmission-line properties that should be considered for accurate prediction of crosstalk, common-mode noise and clock skew. The deficiencies of RC-circuit representation are highlighted and design guideline s are given for using modeling and simulation techniques that have been previously used for package interconnections. Such techniques are believed to teach designers how to make heller use of available technologies and help them architect systems that operate with manv-GHz clock raies. © 2001 IEEE.
Alina Deutsch, Christopher W. Surovic, et al.
IEEE Transactions on Components Packaging and Manufacturing Technology Part B
Alina Deutsch, Thomas-Michael Winkel, et al.
IEEE Transactions on Advanced Packaging
Leland Chang, David J. Frank, et al.
Proceedings of the IEEE
Alina Deutsch, Howard H. Smith, et al.
IEEE Transactions on Advanced Packaging