About cookies on this site Our websites require some cookies to function properly (required). In addition, other cookies may be used with your consent to analyze site usage, improve the user experience and for advertising. For more information, please review your options. By visiting our website, you agree to our processing of information as described in IBM’sprivacy statement. To provide a smooth navigation, your cookie preferences will be shared across the IBM web domains listed here.
Publication
EPEPS 2009
Conference paper
On adding metalization to improve via performance on PCBs
Abstract
The design of printed circuit boards evolves continuously in density, price and performance. In this short paper, we propose an approach where the performance of a via is altered by adding additional metalizations to enhance the ground return path for signals. ©2009 IEEE.