About cookies on this site Our websites require some cookies to function properly (required). In addition, other cookies may be used with your consent to analyze site usage, improve the user experience and for advertising. For more information, please review your options. By visiting our website, you agree to our processing of information as described in IBM’sprivacy statement. To provide a smooth navigation, your cookie preferences will be shared across the IBM web domains listed here.
Publication
APCCAS 1994
Conference paper
Minimizing via coupled noise in high performance thermal conduction module design
Abstract
In the design of thermal conduction modules, chips are interconnected through thin-film layers and glass-ceramic layers. The total amount of noise on the package consists of not only the crosstalk between adjacent signal lines in the X and Y directions, but also the coupled noise between adjacent pins and vias in the Z direction. While the crosstalk between adjacent wires can be minimized by reducing wire length and increasing wire spacing, the via noise problem has never been considered during layout design. This paper introduces the via noise constraints for physical design, and proposes a net ordering and layer assignment method to minimize the via coupled noise in thermal conduction module (TCM) design.