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Grinding forces were measured in aluminas and glass‐ceramics with various microstructures. The microstructures were found to exert a profound influence on the machinability. In particular, the controlling toughness variable is that which pertains to small cracks, not that conventionally measured in a large‐scale fracture specimen. Copyright © 1987, Wiley Blackwell. All rights reserved
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SPIE Advances in Semiconductors and Superconductors 1990
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