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Microelectronic Engineering
Grinding forces were measured in aluminas and glass‐ceramics with various microstructures. The microstructures were found to exert a profound influence on the machinability. In particular, the controlling toughness variable is that which pertains to small cracks, not that conventionally measured in a large‐scale fracture specimen. Copyright © 1987, Wiley Blackwell. All rights reserved
E. Babich, J. Paraszczak, et al.
Microelectronic Engineering
J. Paraszczak, J.M. Shaw, et al.
Micro and Nano Engineering
A. Reisman, M. Berkenblit, et al.
JES
A. Gangulee, F.M. D'Heurle
Thin Solid Films