Mechanical Modeling of the 2D Interfacial Slurry Pressure in CMP

Abstract

Experiments were conducted to measure the two-dimensional fluid pressure in order to determine the total contact pressure during chemical mechanical polishing (CMP). A superposition method was employed to calculate the slurry film thickness by performing an equilibrium analysis of the forces and moments created by the fluid and solid interactions. The film thickness was then used to model the slurry pressure using the polar Reynolds' equation.