About cookies on this site Our websites require some cookies to function properly (required). In addition, other cookies may be used with your consent to analyze site usage, improve the user experience and for advertising. For more information, please review your options. By visiting our website, you agree to our processing of information as described in IBM’sprivacy statement. To provide a smooth navigation, your cookie preferences will be shared across the IBM web domains listed here.
Conference paper
Mechanical Modeling of the 2D Interfacial Slurry Pressure in CMP
Abstract
Experiments were conducted to measure the two-dimensional fluid pressure in order to determine the total contact pressure during chemical mechanical polishing (CMP). A superposition method was employed to calculate the slurry film thickness by performing an equilibrium analysis of the forces and moments created by the fluid and solid interactions. The film thickness was then used to model the slurry pressure using the polar Reynolds' equation.