About cookies on this site Our websites require some cookies to function properly (required). In addition, other cookies may be used with your consent to analyze site usage, improve the user experience and for advertising. For more information, please review your options. By visiting our website, you agree to our processing of information as described in IBM’sprivacy statement. To provide a smooth navigation, your cookie preferences will be shared across the IBM web domains listed here.
Publication
OFC/NFOEC 2010
Conference paper
Low power and high density optical interconnects for future supercomputers
Abstract
Increasing performance in supercomputers requires a concomitant increase in intrasystem interconnect bandwidth. We review the status and prospects of technologies required to build low power, high density board and chip level interconnects. ©2010 Optical Society of America.