Conference paperNEW RELIABLE STRUCTURE FOR HIGH TEMPERATURE MEASUREMENT OF SILICON WAFERS USING A SPECIALLY ATTACHED THERMOCOUPLE.S. Cohen, T.O. Sedgwick, et al.MRS Proceedings 1983
PaperDesigning catalysts with deep generative models and computational data. A case study for Suzuki cross coupling reactionsOliver Schilter, Alain Vaucher, et al.Digital Discovery
PaperWill OLED displays challenge liquid crystal displays in notebook computer applications?Ronald TroutmanSynthetic Metals
Conference paperInvestigation of the numerical accuracy of transmission line-based transient analysis of high-speed interconnects and cablesAndreas C. Cangellaris, Karen M. Coperich, et al.EMC 2001
