Imaging material components of an integrated circuit interconnect

Abstract

The application of x-ray spectromicroscopy and x-ray fluorescence to an integrated circuit interconnect using intermediate energy x rays, near 2 keV, which allows a good interaction length with several key components of integrated circuit interconnects, using recently obtained reference spectra of tantalum and tungsten. Thus, x-ray spectromicroscopy was developed extensively in the soft-x-ray regime for application to polymers and biology. It was performed at the intermediate-energy x-ray beamline 2-1D-B of the Advanced Photon Source.