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A simple u.v. curing process is described that renders micron sized images in AZ resists resistant to flow when heated to temperatures as high as 210° C. The u.v. treatment prevents the image flow problems usually encountered in reactive ion etching processes. © 1981, The Electrochemical Society, Inc. All rights reserved.
Ranulfo Allen, John Baglin, et al.
J. Photopolym. Sci. Tech.
E. Babich, J. Paraszczak, et al.
Microelectronic Engineering
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