S. Cohen, T.O. Sedgwick, et al.
MRS Proceedings 1983
A simple u.v. curing process is described that renders micron sized images in AZ resists resistant to flow when heated to temperatures as high as 210° C. The u.v. treatment prevents the image flow problems usually encountered in reactive ion etching processes. © 1981, The Electrochemical Society, Inc. All rights reserved.
S. Cohen, T.O. Sedgwick, et al.
MRS Proceedings 1983
I. Morgenstern, K.A. Müller, et al.
Physica B: Physics of Condensed Matter
William G. Van der Sluys, Alfred P. Sattelberger, et al.
Polyhedron
Michiel Sprik
Journal of Physics Condensed Matter