Michiel Sprik
Journal of Physics Condensed Matter
A simple u.v. curing process is described that renders micron sized images in AZ resists resistant to flow when heated to temperatures as high as 210° C. The u.v. treatment prevents the image flow problems usually encountered in reactive ion etching processes. © 1981, The Electrochemical Society, Inc. All rights reserved.
Michiel Sprik
Journal of Physics Condensed Matter
Peter J. Price
Surface Science
A. Gangulee, F.M. D'Heurle
Thin Solid Films
Sharee J. McNab, Richard J. Blaikie
Materials Research Society Symposium - Proceedings