C. Lavoie, C. Detavernier, et al.
Microelectronic Engineering
Multilayer films of [Co 10 Å/Cu(t)]64 with copper thicknesses from t=10 to 29 Å annealed for 1 h at temperatures about 350°C showed a decrease in sample resistivity at 4.2 K. The giant magnetoresistance (GMR) maximums for as-deposited films at t=10 Å and t=23 Å shifted with annealing. The GMR decreased for t=10 Å and t=23 Å but increased for t=19 Å and t=29 Å indicating a complex behavior with annealing. Similarities with granular films are discussed.
C. Lavoie, C. Detavernier, et al.
Microelectronic Engineering
C. Cabral Jr., J. Kedzierski, et al.
VLSI Technology 2004
C. Cabral Jr., L. Clevenger, et al.
Journal of Materials Research
K. Barmak, G.A. Lucadamo, et al.
MRS Spring Meeting 1999