Fully analytical methodology for fast end-to-end link analysis on complex printed circuit boards including signal and power integrity effects

Abstract

High speed printed circuit boards (PCBs) can be extremely complex with a large number of via structures and transmission lines. Rapid analysis of on-board high speed nets including the non-TEM effects of vias with full-wave electromagnetic field solvers has been unrealistic. However, using a systematic, cascaded analytical approach, these high speed nets can now be analyzed quick enough to do design discovery and optimization during the pre-layout phase. The self assembly of the cascaded link path, using analytical models for each individual portion, allows this analysis to be performed in very short time, replacing the time consuming traditional full wave simulation techniques without sacrificing accuracy.