F.R. McFeely, K.Z. Zhang, et al.
MRS Fall Meeting 1996
The present study is directed to a new foamed elastomer composition for supporting the interconnecting conductive wires in the ElasticonTM interposer connector for the packaging interconnections, test and burn-in applications. The compressibility of interposer connector can be tailored by introducing controlled volume fraction of foam into elastomer or filled elastomer. The foamed elastomer has been successful applied to a new Ball Grid Array (BGA) module testing socket to meet the contact force requirement.
F.R. McFeely, K.Z. Zhang, et al.
MRS Fall Meeting 1996
E. Burstein
Ferroelectrics
A.B. McLean, R.H. Williams
Journal of Physics C: Solid State Physics
Biancun Xie, Madhavan Swaminathan, et al.
EMC 2011