Fast physics-based via and trace models for signal and power integrity co-analysis

Abstract

Physics-based models for vias and traces including new component models are applied to simulate multilayer interconnects on printed circuit boards. A variety of interconnect structures, including via arrays and differential links between package via fields, are studied with model-to-hardware correlation. These models also enable efficient signal integrity and power integrity co-analysis with focus on modeling simultaneous switching noise coupled into high-speed signal nets as well as understanding the effects of decoupling capacitor placement. Simulation time has been reduced at least three orders of magnitude with respect to comparable full-wave simulations.